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Fine Pitch + Multi-Site

Fine Pitch + Multi-Site

Pitch: 0.35mm

Pin Per DUT: 1600

Aspect Ratio:  50:1

No. of DUTs:  12

Layer Count:  66

Max Data Rate:  16Gbps


High Speed SerDes

High Speed SerDes

Multiple 224Gbps PAM4 (FF: 56 GHz) 

64Gbps PCIE GEN6 (FF:32 GHz)

8533 Mbps LPDDR5x on board

Ultra High Current(1000A )

MLO

MLO

90μm C4 Side Pitch

0.5mm BGA Side Pitch

40μm Laser Via

7 Build-up Layers Per Side

25 Total Layers

1.5mm Thickness

59.8mm X 57.5mm MLO Size

Wire Vertical Probe Card

Wire Vertical Probe Card

Pin Count: 16,013

Pad Pitch:127μm

CCC Per Pin: 625mA

Probe Depth:15mm Include  PCB Thickness

Tip Length: 0.65mm

Tip Shape: Flat

MEMS Probe Card

MEMS Probe Card

Pin Count: 12,200

Pad Pitch: 90μm

CCC Per Pin: 800mA

Probe Depth:13mm

Tip Length: 0.53mm

Tip Shape: Flat

DUT Count: 4

MLO Size: 59.8mm*57.5mm


Wingboard with High Layer Count

Wingboard with High Layer Count

32 DUTS with 0.80mm Pitch

296 Pins Per DUT

47:1 Aspect Ratio

100 Layers 

8Gbps Max Data Rate